MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)
Visa Source Listed
📍🇸🇬 Singapore📅12h ago
S$1,14,000—S$1,54,800/ year
≈ ₹71L — ₹97L per year
Cross-Functional Team LeadershipComputer EngineeringProduct CreationAtlassian ConfluenceOperations ManagementElectricalWritten CommunicationProcess EngineeringInnovative ThinkingJIRAProject Management SoftwareSupply Chain EngineeringGreat communications skillsElectrical Engineering (including power engineerinManufacturing Execution Systems
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Job Description
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison.
As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and deliverables.
Key Responsibilities include, but are not limited to:
Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM.
Provide regular communication of development status, priorities, and challenges across the broader organization.
Set and prioritize tactical expectations across development activities, according to defined milestones and stakeholder needs and expectations.
Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and managing development documentation.
Consolidate and provide the inputs for hardware readiness and capacity planning required to support engineering activities.
Key Requirements
Bachelor’s or Master’s degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
5+ years of relevant technical, manufacturing or experience in driving cross functional teams.
Excellent Communication/Presentation skills.
Excellent written and verbal communication skills for technical and senior management audiences.
Comfortable with data analysis methods and data visualization; communicating data-backed conclusions.
Familiarity and capability with JIRA, Confluence, Project Management software tools.
Having an innovative mindset which is open to improve upon any process or product.